Huawei's Next-Generation Kirin Chip Adopts Unified Memory Architecture to Boost Performance

Huawei's New Kirin Chip with Unified Memory Architecture: A Step Towards AI and Performance Parity

Experience Huawei's innovation with the next-generation Kirin chip, featuring UMA for enhanced AI and overall performance, potentially rivaling Apple and Qualcomm. Discover how Huawei is overcoming sanctions and setting new benchmarks in chip technology.

Huawei's Next-Generation Kirin Chip Adopts Unified Memory Architecture to Boost Performance
Image credit: Smartprix

Innovative Memory Design

Huawei's upcoming Kirin chip will utilize a unified memory architecture (UMA), similar to Apple's M-series silicon and Intel's Core Ultra Series CPUs. This integration means that the RAM will be embedded within the processor, accessible to both the GPU and CPU, enhancing overall performance. According to Weibo user Fixed Focus Digital, the Kirin CPU with Taishan V130 cores could potentially match Apple M3 performance, thanks to double the memory bandwidth of previous PC chips. This design is specifically aimed at AI terminal products.

Overcoming Sanctions and Challenges

Once a global leader in smartphone manufacturing, Huawei faced significant setbacks due to U.S. sanctions stemming from its ties with Beijing. These restrictions cut Huawei off from advanced chips and production facilities like those at TSMC, forcing the company to innovate internally. Despite these hurdles, Huawei has managed to produce chips domestically, such as the Kirin 9000S, though these lag behind due to using older 7nm technology from SMIC.

Advancements and Setbacksa

Huawei's domestic production includes chips like the Kirin 9000S, manufactured using 7nm technology at SMIC, which trails behind the latest nodes from TSMC. Additionally, Huawei's Ascend 910B AI processors have faced issues, with 80% of produced chips being defective. Nevertheless, Fixed Focus Digital notes that the local large model and AI inference speed are heavily reliant on memory bandwidth. The UMA unified memory-DRAM on an IC substrate is expected to outperform current Windows chips.

Competitive Landscape and Future Prospects

Huawei's new Kirin chip might be designed to compete with Qualcomm's Snapdragon X processor, which boasts a 45 TOPs NPU. However, even if Huawei matches Apple and Qualcomm in performance, it remains uncertain if it can leverage Microsoft's AI features, particularly due to potential restrictions on AI code from the U.S. Nevertheless, despite the limitations and slower speeds of Huawei's domestically produced chips, the company's efforts to innovate under stringent conditions are noteworthy.

Potential and Expectations

The true test of Huawei's new chip capabilities will be through public benchmarks and performance comparisons. While Huawei's new chips may currently lag behind U.S. peers, the company's progress under restrictive conditions highlights its potential. Only time will reveal if China can achieve performance parity with the U.S., but Huawei appears to be making significant strides towards catching up with industry giants like AMD, Apple, Intel, and Qualcomm.